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solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2031 Search Time::1.094ms
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				FREESCALE[Freescale Semiconductor, Inc]
Part No.	MPX5010 MPX5010D MPX5010DP MPX5010GP MPX5010GS MPX5010GSX MPXV5010GP MPXV5010D MPXV5010G MPXV5010G6U MPXV5010G7U MPXV5010GC6T1 MPXV5010GC6U MPXV5010GC7U MPXV5010DP
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	435.32K / 18 Page	View it Online	Download Datasheet

				Motorola
Part No.	MPX5010 MPXV5010G
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated
File Size	213.11K / 16 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc
Part No.	MPXHZ6130A10 MPXHZ6130A MPXHZ6130A6U MPXHZ6130AC6U
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.050 1.27 TYP 0.150 3.81 solder reflow process. It is always...
Description	Media Resistant and High Silicon Pressure Sensor for Measuring Absolute Pressure
File Size	175.64K / 11 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc
Part No.	MPXHZ6117AC6T1 MPXHZ6117AC6U MPXHZ6117A MPXHZ6117A6T1 MPXHZ6117A6U
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description	Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated
File Size	195.78K / 11 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc
Part No.	MP3V5004G10 MP3V5004DP MP3V5004G MP3V5004GC6T1 MP3V5004GC6U MP3V5004GP MP3V5004GVP
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description	Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	312.99K / 14 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc Freescale Semiconductor...
Part No.	MPXV7007G6T1 MPXV7007G6U MPXV7007DP MPXV7007GP
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	128.75K / 10 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc
Part No.	MP3V5010 MP3V5010DP MP3V5010GC6T1 MP3V5010GC6U MP3V5010GP MP3V5010GVP
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated
File Size	184.11K / 12 Page	View it Online	Download Datasheet

				Alpha & Omega Semiconductors
Part No.	AOD4184 AOD4184L
OCR Text	...cess 3 leads TO252 Bare Cu Soft solder S: Al, 20mils; G: Au, 1.3mils Epoxy resin with silica filler 90/10 UL-94 V-0 Ti / Ni / Ag Up to Level...Bond Integrity Room Temp 150c bake 150c bake 245c NA 0hr 250hr 500hr 5 sec 0 0 Solderabili...
Description	Plastic Encapsulated Device
File Size	103.37K / 5 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc] MOTOROLA[Motorola Inc]
Part No.	MPXV4006G MPXV4006GC7U MPXV4006GP MPXV4006DP MPXV4006G6T1 MPXV4006G6U MPXV4006G7U MPXV4006GC6T1 MPXV4006GC6U
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	INTEGRATED PRESSURE SENSOR
File Size	309.88K / 12 Page	View it Online	Download Datasheet

				Alpha & Omega Semiconductors
Part No.	AOD456A AOD456AL
OCR Text	...s TO252 Copper with Ni pad Soft solder Al 5&12mils Soft solder 90/10 UL-94 V-0 Ti / Ni / Ag Up to Level 1 * AOD456AL (Green Compound) Standa...Bond Integrity Room Temp 150c bake 150c bake 230c NA 0hr 250hr 500hr 5 sec 0 0 Solderabili...
Description	Plastic Encapsulated Device
File Size	99.49K / 5 Page	View it Online	Download Datasheet

For solder-bond Found Datasheets File :: 2031 Search Time::1.094ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |