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For screwed Found Datasheets File :: 398    Search Time::3.453ms    
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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA13H3340M_06 RA13H3340M RA13H3340M-101 RA13H3340M06
OCR Text ... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description RoHS Compliance , 330-400MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO

File Size 92.90K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA13H4047M_06 RA13H4047M RA13H4047M-101 RA13H4047M06
OCR Text ... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description RoHS Compliance , 400-470MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO

File Size 93.46K  /  8 Page

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    Mitsubishi Electric Semicon...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. RA13H4452M-E01 RA13H4452M RA13H4452M-01
OCR Text ... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description 440-520MHz 13W 12.5V MOBILE RADIO

File Size 63.54K  /  9 Page

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    Mitsubishi Electric Semicon...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA13H4452M_06 RA13H4452M RA13H4452M-101 RA13H4452M06
OCR Text ... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description RoHS Compliance , 440-520MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO

File Size 91.50K  /  8 Page

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    Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA18H1213G_06 RA18H1213G RA18H1213G-101 RA18H1213G06
OCR Text ... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description    RoHS Compliance , 1.24-1.30GHz 18W 12.5V, 3 Stage Amp. For MOBILE RADIO

File Size 105.59K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA30H0608M_06 RA30H0608M RA30H0608M-101 RA30H0608M06
OCR Text ... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description RoHS Compliance , 66-88MHz 30W 12.5V, 2 stage Amp. for MOBILE RADIO

File Size 95.56K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA30H1317M_06 RA30H1317M RA30H1317M-101 RA30H1317M06
OCR Text ... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description RoHS Compliance , 135-175MHz 30W 12.5V 2 Stage Amp. For MOBILE RADIO

File Size 91.18K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA30H1721M-101 RA30H1721M
OCR Text ... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description RoHS Compliance , 175-215MHz 30W 12.5V, 2 Stage Amp. For MOBILE RADIO

File Size 91.23K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA30H2127M_06 RA30H2127M RA30H2127M-101 RA30H2127M06
OCR Text ... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for...
Description RoHS Compliance , 210-270MHz 30W 12.5V, 2 Stage Amp. For MOBILE RADIO

File Size 89.74K  /  8 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA30H3340M_06 RA30H3340M RA30H3340M-101 RA30H3340M06
OCR Text ...sink. The module shall first be screwed to the heat sink, after this the leads can be soldered to the PCB. M3 screws are recommended with tightening torque 0.4 to 0.6Nm. Soldering and Defluxing: This module is designed for manual soldering....
Description RoHS Compliance , 330-400MHz 30W 12.5V, 3 Stage Amp. For MOBILE RADIO

File Size 70.27K  /  7 Page

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For screwed Found Datasheets File :: 398    Search Time::3.453ms    
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