attach pdf Datasheet P11 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : PEEL153 01N60 1N4744CG LX2172 2C63UM PC357NT C1623 MMSZ5225
	Product Description
	Full Text Search

attach Datasheet PDF File

For attach Found Datasheets File :: 8720 Search Time::1.641ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

				Transcom, Inc.
Part No.	TC1404N
OCR Text	...mpatible with standard ausn die-attach. typical applications include commercial and military high performance power amplifiers electrical specifications (t a =25 c) symbol conditions min typ max unit p 1db output power at 1db ...
Description	0.5W High Linearity and High Efficiency GaAs Power FETs
File Size	68.54K / 3 Page	View it Online	Download Datasheet

				Transcom, Inc.
Part No.	TC1401
OCR Text	...patible with standard ausn die-attach. electrical specifications (t a =25 c) symbol conditions min typ max unit p 1db output power at 1db gain compression point, f = 12ghz,v ds = 8 v, i ds = 120 ma 26.5 27 dbm g...
Description	0.5 W High Linearity and High Efficiency GaAs Power FETs
File Size	155.21K / 4 Page	View it Online	Download Datasheet

				Transcom, Inc.
Part No.	TC1401N
OCR Text	...mpatible with standard ausn die-attach. electrical specifications (t a =25 c) symbol conditions min typ max unit p 1db output power at 1db gain compression point , f = 12ghz,v ds = 8 v, i ds = 120 ma 26.5 27 dbm g...
Description	0.5 W High Linearity and High Efficiency GaAs Power FETs
File Size	171.68K / 5 Page	View it Online	Download Datasheet

				Intersil, Corp. Intersil Corporation
Part No.	ISL54211IRTZ-T ISL54211IRUZ-T
OCR Text	...ial sets, molding compounds/die attach materials , and 100% matte tin plate plus anneal (e3 termination fi nish, which is rohs compliant and compatible with both snpb and pb-free soldering operations). intersil pb-free products are msl c...
Description	MP3/USB 2.0 High Speed Switch with Negative Signal Handling/Click and Pop Suppression; Temperature Range: -40°C to 85°C; Package: 10-TDFN T&R SGL POLE DOUBLE THROW SWITCH, DSO10
File Size	1,204.70K / 19 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard)
Part No.	W2636A
OCR Text	... leaded or lead-free solder to attach the bga probe adapter. we recommend you attach the bga probe during the manufacturing process. for designs that are manufactured, it will require expertise to attach the bga probe adapter. if you...
Description	DDR3 BGA Probe Adapter
File Size	563.04K / 11 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard)
Part No.	W2635A
OCR Text	... leaded or lead-free solder to attach the bga probe adapter. we recommend you attach the bga probe during the manufacturing process. for designs that are manufactured, it will require expertise to attach the bga probe adapter. if you...
Description	BGA Probe Adapter for Infiniium Oscilloscopes
File Size	532.63K / 11 Page	View it Online	Download Datasheet

				TriQuint Semiconductor
Part No.	TGS4306-FC
OCR Text	...tes component placement and die attach assembly notes: ? vacuum pencils and/or vacuum collets are the prefe rred method of pick up. ? air bridges must be avoided during placement. ? cu pillars on die are 65 um tall with a 22 um tall sn sold...
Description	70-90 GHz SP4T Switch Flip Chip
File Size	273.53K / 11 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	CF001-0308
OCR Text	...s or w? - waffle trays die attach: conductive epoxy or preform die attach is recom- mended. for preform die attach: preform: ausn (80% au, 20% sn); stage temperature: 290 oc, +/-5 oc; handling tool: tweezers; time: 1 min or less. wi...
Description	GaAs Pseudomorphic HEMT Transistor
File Size	488.71K / 4 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	CF001-01 CF001-0108
OCR Text	...s or w? - waffle trays die attach: conductive epoxy or preform die attach is recom- mended. for preform die attach: preform: ausn (80% au, 20% sn); stage temperature: 290 oc, +/-5 oc; handling tool: tweezers; time: 1 min or less. wi...
Description	GaAs MESFET Transistor
File Size	355.88K / 3 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC49009
OCR Text	... way to accom- plish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should brought as close to th...
Description	GaAs PHEMT MMIC LOW NOISE HIGH IP3 AMPLIFIER, 12 - 17 GHz
File Size	266.75K / 6 Page	View it Online	Download Datasheet

For attach Found Datasheets File :: 8720 Search Time::1.641ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |