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    15-80-0325 A-70567-0150 0015800325

Molex Electronics Ltd.
Part No. 15-80-0325 A-70567-0150 0015800325
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Renesas Electronics Corporation

Part No. 2SK1580(0)-T1-AT
Description Power MOSFETs for Automotive, SSP, /
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800147 15-80-0147 A-70567-0209

Molex Electronics Ltd.
Part No. 0015800147 15-80-0147 A-70567-0209
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating

File Size 1,218.31K  /  7 Page

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Renesas Electronics Corporation

Part No. 2SK1580(0)-T1-A
Description Power MOSFETs for Automotive, SSP, /
Tech specs    

Official Product Page

    0015800169 15-80-0169 A-70567-0278

Molex Electronics Ltd.
Part No. 0015800169 15-80-0169 A-70567-0278
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00119LLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Dual PCB Connector 24A 48V, Solder-to-Board, Insert M3, Carton Box.
Tech specs    

Official Product Page

    0015800149 15-80-0149 A-70567-0277

Molex Electronics Ltd.
Part No. 0015800149 15-80-0149 A-70567-0277
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00412XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Single PCB Connector 24A 48V, Pin-in-Paste, Insert UNC 4.40, Tape and Reel.
Tech specs    

Official Product Page

    0015800165 15-80-0165 70567-0142 A-70567-0142

Molex Electronics Ltd.
Part No. 0015800165 15-80-0165 70567-0142 A-70567-0142
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00419XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Single PCB Connector 24A 48V, Pin-in-Paste, Insert UNC 4.40, Carton Box.
Tech specs    

Official Product Page

    0015800205 15-80-0205 70567-0144

Molex Electronics Ltd.
Part No. 0015800205 15-80-0205 70567-0144
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00119XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Dual PCB Connector 24A 48V, Solder-to-Board, Insert UNC 4.40, Carton Box.
Tech specs    

Official Product Page

    15-80-0087 0015800087 A-70567-0206

Molex Electronics Ltd.
Part No. 15-80-0087 0015800087 A-70567-0206
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.48K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00219XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Dual PCB Connector 24A 48V, Pin-in-Paste, Insert UNC 4.40, Carton Box.
Tech specs    

Official Product Page

    15-80-0085 0015800085 A-70567-0138

Molex Electronics Ltd.
Part No. 15-80-0085 0015800085 A-70567-0138
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati
Molex Electronics Ltd.

File Size 1,218.46K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00319XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Single PCB Connector 24A 48V, Solder-to-Board, Insert UNC 4.40, Carton Box.
Tech specs    

Official Product Page

    0015800685 70567-0168 A-70567-0168 15-80-0685

Molex Electronics Ltd.
Part No. 0015800685 70567-0168 A-70567-0168 15-80-0685
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective P
MOLEX Connector

File Size 1,218.47K  /  7 Page

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    0015800209 15-80-0209 A-70567-0280

Molex Electronics Ltd.
Part No. 0015800209 15-80-0209 A-70567-0280
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.34K  /  7 Page

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