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  solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2135    Search Time::11.531ms    
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    SIDC46D170H04

Infineon Technologies AG
Infineon Technologies A...
Part No. SIDC46D170H04
OCR Text ... suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm; max 1.2mm recommended storage environment store in original container, in...
Description Fast switching diode chip in EMCON 3 -Technology
   Fast switching diode chip in EMCON 3 -Technology

File Size 62.59K  /  4 Page

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    HMMC-3040

Agilent(Hewlett-Packard)
Part No. HMMC-3040
OCR Text ... the preferred assembly method. solder die attach using a fluxless gold-tin solder preform can also be used. the device should be attached t...bond wires, multiple wires can be attached to the rf bonding pads. thermosonic wedge is the preferre...
Description 20-43 GHz Double-Balanced Mixer With an LO-Amplifier(20-43 GHz带有LO放大器的双均衡混频器)

File Size 228.92K  /  6 Page

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    Anadigics
Part No. ATA7601
OCR Text ...tal and can be epoxy mounted or solder attached. A good thermally conductive, silver filled epoxy is recommended for epoxy mounting. If a so...bond force, time and ultrasonic power are all critical parameters and may require optimization to ac...
Description Transimpedance Amplifiers (TIAs)

File Size 211.95K  /  12 Page

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    INFINEON[Infineon Technologies AG]
Part No. SIDC01D120H6 Q67050-A4171-A001
OCR Text ...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 250m 0.3 mm store in original container, in ...bond configuration) Symbol VRRM IF I FSM I FRM Tj , Ts t g Condition Value 1200 0.6 Unit...
Description Fast switching diode chip in EMCON-Technology

File Size 65.31K  /  4 Page

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    INFINEON[Infineon Technologies AG]
Part No. SIDC02D60F6 Q67050-A4157-A001
OCR Text ...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 250m 0.65mm ; max 1.2mm store in original con...bond configuration) Symbol VRRM IF I FSM Condition Value 600 3 Unit V tP = 10 ms sinu...
Description Fast switching diode chip in EMCON-Technology

File Size 68.17K  /  4 Page

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    INFINEON[Infineon Technologies AG]
Part No. SIDC03D120H6 Q67050-A4156-A001
OCR Text ...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500m 0.65mm ; max 1.2mm store in original con...bond configuration) Symbol VRRM IF I FSM I FRM Tj , Ts t g Condition Value 1200 3 Unit V...
Description Fast switching diode chip in EMCON-Technology

File Size 68.03K  /  4 Page

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    HMMC-5021 HMMC-5022 HMMC-5026

Agilent(Hewlett-Packard)
Part No. HMMC-5021 HMMC-5022 HMMC-5026
OCR Text ... match. Assembly Techniques Solder die-attach using a fluxless AuSu solder preform is the recommended assembly method. Gold thermosonic ...Bond to 15 nF DC Feedthru 68 pF Capacitor Input and Output Thin Film Circuit with 8 pF DC Blockin...
Description 2-22 GHz GaAs MMIC Traveling Wave Amplifier(2-22 GHz砷化镓单片微波集成电路行波放大器)
2-26.5 GHz GaAs MMIC Traveling Wave Amplifier(2-26.5 GHz砷化镓单片微波集成电路行波放大器)

File Size 96.03K  /  6 Page

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    INFINEON[Infineon Technologies AG]
Part No. SIDC03D60F6 Q67050-A4037-A001
OCR Text ...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 250m 0.65mm ; max 1.2mm store in original con...bond configuration) Symbol VRRM IF I FSM Condition Value 600 6 Unit V tP = 10 ms sinu...
Description Fast switching diode chip in EMCON-Technology

File Size 64.82K  /  4 Page

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For solder-bond Found Datasheets File :: 2135    Search Time::11.531ms    
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