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bonding Datasheet PDF File

For bonding Found Datasheets File :: 7146 Search Time::1.187ms
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				Iterra
Part No.	ITR39100
OCR Text	...nt to prevent contamination of bonding surfaces . these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist-grounding straps. all die attach and wire/ribbon bond equipment must be wel...
Description	power amplifier MMIC
File Size	438.54K / 7 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC592
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description	high dynamic range GaAs PHEMT MMIC 2 Watt Power Amplifi
File Size	411.88K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC591 HMC59109
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description	GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER, 6 - 10 GHz
File Size	296.07K / 8 Page	View it Online	Download Datasheet

				UMS[United Monolithic Semiconductors]
Part No.	CHV2242A CHV2242A-99F_00 CHV2242A-99F/00
OCR Text	...the RF pads the equivalent wire bonding inductance (diameter=25m) has to be according to the following recommendation. Port ERC1 (2) ERC2 (19) RF_out (16) Equivalent inductance (nH) L_erc1 = 0.4 L_erc2 = 0.4 L_out = 0.28 Approximated wire l...
Description	Q-band VCO based on Ku-band Oscillator and Q-band Multiplier
File Size	809.51K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC591
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description	GaAs PHEMT MMIC 2-Watt Power Amplifier
File Size	423.17K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC590 HMC59009
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description	GaAs PHEMT MMIC 1 WATT POWER AMPLIFIER, 6 - 10 GHz
File Size	287.05K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC590
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description	high dynamic range GaAs PHEMT MMIC 1 Watt Power Amplifi
File Size	409.79K / 8 Page	View it Online	Download Datasheet

For bonding Found Datasheets File :: 7146 Search Time::1.187ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |